Renesas Electronics Corporation has opened a new Physical AI & Robotics Lab in Beijing, China, providing customers and development partners with a dedicated environment for system-level demonstration, validation and joint development of next-generation robotic systems. The facility will support projects from proof-of-concept through deployment, bringing hardware, software, sensing, control, power and AI development together within a common engineering environment.
The new lab follows Renesas’ creation of its Physical AI Division on July 1, 2026, as the company expands its focus on robotics and other systems that combine AI with real-time interaction in the physical world. For humanoid and other advanced robotic platforms, development increasingly requires coordination across embedded processing, sensing, actuation, motion control, power management and software rather than optimization of individual components in isolation.
Renesas’ Physical AI & Robotics Lab in Beijing will support system-level demonstration, validation and joint development of next-generation robotics and Physical AI systems.
“Humanoid robots are becoming more sophisticated and complex, driving demand for hardware and software systems that must work together seamlessly,” said Ivo Marocco, Vice President and Head of UX at Renesas. “Today, Renesas can address roughly 30% of the humanoid robot BOM, and we see an opportunity to expand that coverage to 70% through our strengths in control, power, sensing, AI, software and ecosystem solutions. Our new lab will help customers validate complete systems and accelerate the deployment of next-generation robotics innovations.”
The Beijing facility will integrate hardware, software, AI modeling, control, power supply, sensing and system-level verification across robotics development and validation workflows. Rather than serve primarily as a product showcase, the lab is intended to give customers, ecosystem partners and Renesas engineers a platform for validating and co-developing complete robotics solutions as projects move toward deployment.
Renesas brings semiconductor technologies spanning processing and motion control, sensing, actuation and power management to these applications. The company is also combining those technologies with functional safety, edge AI and Renesas 365, its cloud-based electronics development platform, as robotics developers look to integrate increasingly complex hardware and software into scalable systems.
“China continues to lead in robotics innovation and adoption with a deep customer base, a highly collaborative ecosystem and a comprehensive supply chain service system,” said Yvonne Liu, Vice President and President of Renesas China. “Renesas will leverage its Physical AI Lab in Beijing and its technology capabilities to collaborate closely with customers, ecosystem partners, universities and startups. As part of Renesas’ key strategy in China, this lab will accelerate the engineering implementation of physical AI systems.”
The lab will also connect Renesas with robotics developers, universities, startups and other technology partners as the company expands its Physical AI activities. The emphasis on system-level validation and co-development is intended to address the engineering work required to move robotic technologies beyond individual components and prototype demonstrations into deployable systems.
About Renesas Electronics Corporation
Renesas Electronics Corporation is a Tokyo, Japan-headquartered semiconductor company specializing in embedded processing, analog, power and connectivity technologies. Its portfolio supports automotive, industrial, infrastructure and IoT applications and includes microcontrollers, processors, analog and mixed-signal devices, power management, sensing and connectivity technologies. Renesas employed 21,629 people worldwide as of December 31, 2025, and generated approximately ¥1.32 trillion in consolidated revenue during fiscal 2025. The company is publicly traded on the Tokyo Stock Exchange under the symbol 6723. For more information, please click here.
Source/Photo Credit: Renesas Electronics Corporation
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